NewsHand Sign Recognition at Hannover Messe, 30 May to 2 June 2022
Hand Sign Recognition via Deep Learning on Tightly-coupled Processor Arrays at Hannover Messe 2022: The Chair for Hardware/Software Co-Design demonstrated in cooperation with the FAU Research Center Embedded Systems Initiative (FAU ESI) a Hand Sign Recognition via Deep Learning on Tightly-coupled Processor Arrays (TCPAs) as part of the joint booth of BayernInnovativ at Hannover Messe […]Hand Sign Recognition via Deep Learning on Tightly-coupled Processor Arrays at Hannover Messe 2022: The Chair for Hardware/Software Co-Design demonstrated in cooperation with the FAU Research Center Embedded Systems Initiative (FAU ESI) a Hand Sign Recognition via Deep Learning on Tightly-coupled Processor Arrays (TCPAs) as part of the joint booth of BayernInnovativ at Hannover Messe […]
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